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US 7,608,520 B2Granted
Method for bonding substrate, bonded substrate, and direct bonded substrate
AssigneePanasonic Corporation
InventorsTomoya Sugita, Kiminori Mizuuchi
Life of this patent
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Abstract
The present invention relates to a method for laminating substrates, including locating positioning a surface of a first substrate and a surface of a second substrate at positions close to each other, or partially bringing them in partial contact with each other; supplying a volatile liquid between the surface of the first substrate and the surface of the second substrate; and evaporating the volatile liquid so as to laminate the substrates with each other.
Claims23
A method for laminating substrates, comprising:
- positioning a lower surface of an upper substrate adjacent to an upper surface of a lower substrate such that the upper surface and the lower surface are mutually facing so as to define an air space between the lower surface and the upper surface;
- after said positioning of the lower surface of the upper substrate adjacent to the upper surface of the lower substrate so as to define the air space, interposing a volatile liquid into the air space between the lower surface of the upper substrate and the upper surface of the lower substrate so as to replace air in the air space and cause an attracting force to arise between the volatile liquid and the upper and lower substrates;
- and
- causing a tightly attached state between the upper substrate and the lower substrate by causing the weight of the upper substrate and said attracting force to bring the lower surface of the upper substrate into a contact state with the upper surface of the lower substrate via the volatile liquid, and by allowing evaporation of the volatile liquid between the lower surface and the upper surface, without application of an external pressing force to the upper substrate or the lower substrate.
1 more element
A method for laminating substrates, comprising:
- positioning a lower surface of an upper substrate adjacent to an upper surface of a lower substrate such that the upper surface and the lower surface are mutually facing so as to define an air space between the lower surface and the upper surface;
- after said positioning of the lower surface of the upper substrate adjacent to the upper surface of the lower substrate so as to define the air space, interposing a volatile liquid into the air space between the lower surface of the upper substrate and the upper surface of the lower substrate so as to replace air in the air space and cause an attracting force to arise between the volatile liquid and the upper and lower substrates;
- and
- causing a tightly attached state between the upper substrate and the lower substrate by causing the weight of the upper substrate and said attracting force to bring the lower surface of the upper substrate into a contact state with the upper surface of the lower substrate via the volatile liquid, and by allowing evaporation of the volatile liquid between the lower surface and the upper surface, without application of an external pressing force to the upper substrate or the lower substrate,
- wherein said interposing of the volatile liquid comprises extruding the volatile liquid between the lower surface and the upper surface by a capillary action;
- wherein the air space is formed by a distance between the lower surface of the upper substrate and the upper surface of the lower substrate, the distance being less than 10 μm.
3 more elements
Dependencies are inferred from the claim text.