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US 7,608,163 B2Granted
Substrate processing apparatus and method
AssigneeTokyo Electron Limited
InventorMasaki Taira
Life of this patent
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AssigneeTokyo Electron Limited
InventorMasaki Taira
Estimating the term…
In a substrate processing apparatus that supports substrates W by a plurality of holding members of a rotor to process the substrates W rotated by the rotor, any one of the holding members is provided with press devices 130 to apply pressures on the peripheries of the substrates W. Each press device 130 has an abutting part 160 for contact with the periphery of the substrate W, a cylinder mechanism 161 for moving the abutting part 160 between a position in contact with the periphery of the substrate W and another position apart from the periphery of the substrate W and a deformable part 162 elastically deformed by the movement of the abutting part 160 to isolate the cylinder mechanism 161 from an atmosphere around the substrates W. Consequently, it is possible to provide the substrate processing apparatus and method that do not cause a diaphragm to be deformed excessively.
A substrate processing apparatus for processing substrates, comprising a rotor having holding members for holding peripheries of the substrates, the rotor rotating the substrates thereby processing the substrates, one of the holding members having press devices for applying pressures on the peripheries of a plurality of the substrates, the press devices having respective abutting parts, each of the press devices being configured to cause the abutting part thereof to come into elastic contact with or depart from the periphery of a corresponding one of the substrates by fluid pressure in a direction parallel to a surface of the corresponding substrate, the press devices of said one of the holding members pressing the corresponding substrates against another holding member to hold the corresponding substrates, respectively, the substrate processing apparatus further comprising a pressure device configured to apply the fluid pressure to the press devices;
A substrate processing apparatus for processing substrates, comprising a rotor having a first holding member, a second holding member, a third holding member and a fourth holding member, each of the first and second holding members for holding peripheries of the substrates arranged in parallel with each other, the rotor rotating the substrates thereby processing the substrates, the third and fourth holding members each having holding grooves the first and second holding members each having press devices for applying pressures on the peripheries of the substrates to press the substrates against the corresponding holding grooves, the press devices having respective abutting parts, the press devices being configured to cause the abutting parts to come into elastic contact with or depart from the peripheries of the substrates by fluid pressure in a direction parallel to a surface of the corresponding substrate, a pitch of the abutting parts of the first and second holding members being twice as long as a pitch of the holding grooves, the press devices of the first holding member being arranged on the circumferential sides of odd-numbered substrates, the press devices of the second holding member being arranged on the circumferential sides of even-numbered substrates.
Dependencies are inferred from the claim text.