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US 7,582,514 B2Granted
Microelectromechanical systems encapsulation process with anti-stiction coating
AssigneeRobert Bosch GmbH
InventorsCyril Vancura, Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Franz Laermer, Silvia Kronmueller
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Abstract
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.
Claims27
A process for making a MEMS device comprising:
- providing on a substrate an encapsulated MEMS structure comprising a released device layer and a vented cap layer;
- depositing a sacrificial spacer layer;
- depositing an epitaxial film;
- patterning the film;
- forming a high-temperature stable anti-stiction coating on the MEMS structure;
- and,
- sealing the structure, wherein sealing the structure comprises forming the anti-stiction coating at the same time as sealing.
4 more elements
Dependencies are inferred from the claim text.