Back to results
US 7,547,335 B2Granted
Metal polishing composition and method of polishing using the same
AssigneeFUJIFILM Corporation
InventorsHiroyuki Seki, Katsuhiro Yamashita, Tomohiko Akatsuka, Tadashi Inaba
Life of this patent
Estimating the term…
Abstract
A metal polishing composition comprising at least one of the compound represented by formula (1) defined herein and the compound represented by formula (2) defined herein, and an oxidizing agent, and a chemical mechanical polishing method comprising bringing the metal polishing composition into contact with a surface to be polished and providing a relative movement between the surface to be polished and a polishing surface.
Claims6
A metal polishing composition comprising a compound represented by formula (1):
- wherein R1 represents a single bond, an alkylene group or a phenylene group;
- R2 and R3 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group or an aryl group;
- and R4 and R5 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group or an acyl group provided that when R1 represents a single bond, R4 and R5 do not simultaneously represent a hydrogen atom;
- and a compound represented by formula (2):
- wherein R6 represents a single bond, an alkylene group or a phenylene group;
- R7 and R8 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group or an aryl group;
- R9 represents a hydrogen atom, a halogen atom, a carboxyl group or an alkyl group;
- R10 represents an alkylene group;
- with proviso that, when R10 represents a methylene group, formula (2) satisfies at least one of a condition that R6 is not a single bond and a condition that R9 is not a hydrogen atom,
- and an oxidizing agent.
7 more elements
Dependencies are inferred from the claim text.