Method of manufacturing single crystal Si film

A method of manufacturing a single crystal Si film comprising:

• preparing a Si substrate on which a first oxide layer is formed and an insulating substrate on which a second oxide layer is formed;
• forming a dividing layer at a predetermined depth of less than 1000 Å from the surface of the Si substrate by implanting hydrogen ions from above the first oxide layer;
• bonding the insulating substrate to the Si substrate so that the first oxide layer contacts the second oxide layer;
• forming a single crystal Si film having a predetermined thickness of less than 1000 Å on the insulating substrate by cutting the dividing layer by irradiating a laser beam from above the insulating substrate, wherein the implanted hydrogen ions are locally heated by the laser beam to cut the dividing layer;
• and
• removing residue of the dividing layer remaining on the insulating substrate using a polishing apparatus.

A method of manufacturing a single crystal Si film, comprising:

• preparing a Si substrate on which a first oxide layer is formed and an insulating substrate on which a second oxide layer is formed;
• forming a dividing layer at a predetermined depth of less than 1000 Å from the surface of the Si substrate by implanting hydrogen ions from above the first oxide layer;
• bonding the insulating substrate to the Si substrate so that the first oxide layer contacts the second oxide layer;
• and
• forming a single crystal Si film having a predetermined thickness of less than 1000 Å on the insulating substrate by cutting the dividing layer by irradiating a laser beam from above the insulating substrate and removing residue from the dividing layer;
• wherein the laser beam passes through to the implanted hydrogen ions;
• wherein the implanted hydrogen ions are locally heated by the laser beam to cut the dividing layer;
• and
• wherein the laser beam is a CW YAG laser beam or a UV pulsed laser beam.

A method of manufacturing a single crystal Si film, comprising:

• preparing a Si substrate on which a first oxide layer is formed and an insulating substrate on which a second oxide layer is formed;
• forming a dividing layer at a predetermined depth from the surface of the Si substrate by implanting hydrogen ions from above the first oxide layer;
• bonding the insulating substrate to the Si substrate so that the first oxide layer contacts the second oxide layer;
• and
• forming a single crystal Si film having a predetermined thickness on the insulating substrate by cutting the dividing layer by irradiating a laser beam from above the insulating substrate;
• wherein preparing the Si substrate on which a first oxide layer is formed includes:
• preparing the Si substrate;
• and
• forming the first oxide layer is a SiO2 layer on the surface of the Si substrate using chemical vapor deposition (CVD);
• wherein preparing the insulating substrate on which a second oxide layer is formed includes:
• preparing the insulating substrate;
• and
• forming the second oxide layer is a SiO2 layer on a surface of the insulating substrate using chemical vapor deposition (CVD);
• further comprising activating the first oxide layer and the second oxide layer by treating the surfaces of the first oxide layer and the second oxide layer using oxygen plasma, between forming the dividing layer and bonding the insulating substrate;
• wherein forming the single crystal Si film having a predetermined thickness on the insulating substrate by cutting the dividing layer by irradiating a laser beam from above the insulating substrate includes:
• heating the dividing layer by irradiating a laser beam from above the insulating substrate;
• cutting the dividing layer;
• and
• removing residue of the dividing layer remaining on the insulating substrate using a polishing apparatus, to obtain a single crystal Si film having a predetermined thickness on the insulating substrate;
• wherein the insulating substrate is a transparent substrate;
• and
• wherein the laser beam passes through to the implanted hydrogen ions, wherein the implanted hydrogen ions are locally heated by the laser beam to cut the dividing layer,
• wherein the transparent substrate is a glass substrate or a plastic substrate;
• wherein the dividing layer is located less than 1000 Å below the surface of the Si substrate;
• wherein the thickness of the single crystal Si film is less than 1000 Å;
• wherein the laser beam is a CW YAG laser beam or a UV pulsed laser beam;
• wherein the wavelength of the laser beam is in the range of 400-800 nm;
• and
• wherein the implanted hydrogen ions are locally heated by the laser beam to cut the dividing layer.