Plasma display device, TCP applied thereto, and method of manufacturing the TCP
AssigneeSamsung SDI Co., Ltd.
InventorsKi-Jung Kim, Eun-Gon Kim
Life of this patent
Estimating the term…
Abstract
A plasma display device includes a plasma display panel, a chassis base coupled to the plasma display panel, a drive circuit coupled to the chassis base, a flexible printed circuit (FPC) couples the drive circuit to electrodes of the plasma display panel. An integrated circuit (IC) is mounted on a film structured in the form of a tape carrier package (TCP), and coupled to the FPC. An epoxy resin deposited in a connecting region where the driver IC is connected to wiring of the FPC is formed with an uneven area that includes indentations and protrusions formed substantially uniformly.
Claims16
A plasma display device, comprising:
- a plasma display panel;
- a chassis base coupled to the plasma display panel;
- a drive circuit coupled to the chassis base;
- a flexible printed circuit (FPC) coupling the drive circuit and the plasma display panel;
- an integrated circuit (IC) coupled to the FPC;
- and
- an epoxy resin deposited in a coupling region where the IC is coupled to the FPC,
- wherein the epoxy resin has a surface comprising an indentation and a protrusion, and wherein the indentation and the protrusion do not contact the IC or the FPC.
A tape carrier package, comprising:
- a flexible printed circuit (FPC) having a beam lead extending into a window area of the FPC;
- an integrated circuit (IC) coupled to the beam lead;
- and
- an epoxy resin in the window area of the FPC to protect the IC and the beam lead,
- wherein indentations and protrusions are formed on an outer surface of the epoxy resin, and wherein the indentations and the protrusions do not contact the IC or the FPC.
A plasma display device, comprising:
- a plasma display panel;
- a chassis base coupled to the plasma display panel;
- a drive circuit coupled to the chassis base;
- a flexible printed circuit (FPC) coupling the drive circuit and the plasma display panel;
- an integrated circuit (IC) coupled to the FPC;
- and
- an epoxy resin deposited in a coupling region where the IC is coupled to the FPC, the epoxy resin comprising a first side and a second side, the second side comprising a plurality of indentations and protrusions,
- wherein first side contacts the IC, and the indentations and the protrusions do not contact either the IC or the FPC.
Dependencies are inferred from the claim text.