Encapsulated microstructure and method of producing one such microstructure
AssigneeCommissariat a l'Energie Atomique
InventorsBernard Diem, Gilles Delapierre
Life of this patent
Estimating the term…
Abstract
A microstructure including in a first layer insulated from a substrate by an insulator layer at least one sensitive element connected to at least one contact pad by an electrical connection and protected by a package cap. The sensitive element, the electrical connection, and the contact pad form an assembly delimited in the first layer by at least one trench, the assembly being covered by the package cap. The package cap includes at least one opening above the contact pad and is integral with the contact pad on the edges of the opening and with a zone located beyond the trench in relation to the assembly. Such a microstructure can find application in particular in microelectromechanical structures.
Claims14
Microstructure comprising, at least one contact pad and at least one sensitive element connected to said at least one contact pad by an electrical connection, said sensitive element, said contact pad and said electrical connection forming an assembly, said assembly comprising a first layer insulated from a substrate by an insulator layer, said assembly including at least one trench in the first layer, said assembly being covered by a package cap, said package cap comprising at least one opening above the at least one contact pad and being integral with, on the one hand, the contact pad on the edges of the opening and, on the other hand, a zone of the first layer located beyond the trench in relation to the assembly.
Dependencies are inferred from the claim text.