Component interconnect with substrate shielding

A circuit structure comprising:

• a first dielectric layer having first and second surfaces and an at least partially hollow elongate channel having opposite walls extending at least partially between the first and second surfaces;
• a first conductive layer disposed on at least a portion of the first surface;
• a first elongate conductor disposed on the second surface of the first dielectric layer and having opposite sides and an end extending between the sides, the channel being spaced from the first conductor and including at least a first channel portion, the first channel portion extending transverse to the conductor sides, spaced from and adjacent to the conductor end, and having an end, the channel including a second channel portion extending along at least a portion of the conductor end, the second channel portion also having an end facing the end of the first channel portion, the ends of the first and second portions being spaced apart, with a portion of the first dielectric layer adjacent to the conductor end extending between the respective ends of the first and second portions of the channel;
• a second conductive layer lining at least the walls of the first channel portion, the second conductive layer being insufficient to fill the first channel portion, and extending along the portion of the dielectric layer;
• a first interconnect;
• and
• a substrate component mounted on the second surface spaced from the conductor end, and having a terminal, the first interconnect extending between the conductor end and the substrate component terminal;
• at least a first portion of the substrate component being mounted on the portion of the dielectric layer.

A circuit structure comprising:

• a first dielectric layer having first and second surfaces and an at least partially hollow elongate channel having opposite walls extending at least partially between the first and second surfaces;
• a first conductive layer disposed on at least a portion of the first surface;
• a first elongate conductor disposed on the second surface of the first dielectric layer and having opposite sides and an end extending between the sides, the channel being spaced from the first conductor and including at least a first channel portion, the first channel portion extending transverse to the conductor sides, spaced from and adjacent to the conductor end, and having an end, the channel including a second channel portion extending along at least a portion of the conductor end, the second channel portion also having an end facing the end of the first channel portion, the ends of the first and second portions being spaced apart, with a portion of the first dielectric layer adjacent to the conductor end extending between the respective ends of the first and second portions of the channel;
• a second conductive layer lining at least the walls of the first channel portion, the second conductive layer being insufficient to fill the first channel portion;
• a first interconnect;
• and
• a substrate component mounted on the second surface spaced from the conductor end, and having a terminal, the first interconnect extending between the conductor end and the substrate component terminal;
• at least a first portion of the substrate component being mounted on the portion of the dielectric layer and a second portion of the substrate component extending over the channel.

A circuit structure comprising:

• a first dielectric layer having first and second surfaces and an at least partially hollow elongate channel having opposite walls extending at least partially between the first and second surfaces;
• a first conductive layer disposed on at least a portion of the first surface;
• a first elongate conductor disposed on the second surface of the first dielectric layer and having opposite sides and an end extending between the sides, the channel being spaced from the first conductor and including at least a first channel portion extending transverse to the conductor sides, and spaced from, adjacent to, and extending continuously along the conductor end;
• a second conductive layer lining at least the walls of the first channel portion, the second conductive layer being insufficient to fill the first channel portion;
• a second dielectric layer;
• a third conductive layer;
• a second elongate conductor;
• and
• a second interconnect;
• the second dielectric layer having a first surface contacting the first conductive layer opposite the first dielectric layer, and a second surface, the third conductive layer being disposed on at least a portion of the second surface of the second dielectric layer, the channel extending along the sides of the first and second conductors and extending only through the first dielectric layer along the first conductor, at least a portion of the channel extending through the first conductive layer and the second dielectric layer, the second conductor being spaced from the first conductive layer and disposed between the first surface of the first dielectric layer and the first surface of the second dielectric layer, and the second interconnect extending between the first and second conductors.

A circuit structure comprising:

• a first dielectric layer having first and second surfaces and an at least partially hollow elongate channel having opposite walls extending at least partially between the first and second surfaces;
• a first conductive layer disposed on at least a portion of the first surface;
• a first elongate conductor disposed on the second surface of the first dielectric layer and having opposite sides and an end extending between the sides, the channel being spaced from the first conductor and including at least a first channel portion, the first channel portion extending transverse to the conductor sides, spaced from and adjacent to the conductor end, and having an end, the channel including a second channel portion extending along at least a portion of the conductor end, the second channel portion also having an end facing the end of the first channel portion, the ends of the first and second portions being spaced apart, with a portion of the first dielectric layer adjacent to the conductor end extending between the respective ends of the first and second portions of the channel;
• a second conductive layer lining at least the walls of the first channel portion, the second conductive layer being insufficient to fill the first channel portion;
• a first interconnect;
• and
• a substrate component mounted on the second surface spaced from the conductor end and extending directly over the channel, and having a terminal, the first interconnect extending between the conductor end and the substrate component terminal.

A circuit structure comprising:

• a first dielectric layer having first and second surfaces;
• a first conductive layer disposed on at least a portion of the first surface of the first dielectric layer;
• a first conductor disposed on the second surface of the first dielectric layer;
• a second conductive layer disposed on at least a portion of the second surface of the first dielectric layer spaced from the first conductor;
• a second dielectric layer having a first surface contacting the first conductive layer opposite the first dielectric layer, and a second surface;
• a third conductive layer disposed on at least a portion of the second surface of the second dielectric layer;
• a second conductor spaced from the first conductive layer and disposed between the first surface of the first dielectric layer and the first surface of the second dielectric layer;
• a first interconnect extending between the first and second conductors;
• and
• a conductive wall disposed directly over the second conductor, connected to the second conductive layer, and mounted on and extending upwardly away from the second surface of the first dielectric layer.