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US 7,410,904 B2Granted
Sensor produced using imprint lithography
AssigneeHewlett-Packard Development Company, L.P.
InventorsJames Stasiak, Kevin Peters
Life of this patent
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Abstract
The disclosure relates to a process including depositing an imprintable layer on a substrate. The imprintable layer is imprinted into the pattern of an imprint-fabricated ribbon. The pattern from the imprintable layer is transferred to the substrate to be used to fabricate the imprint-fabricated ribbon.
Claims52
A method comprising:
- fabricating an imprint-fabricated ribbon using imprint lithography, including integrating the imprint-fabricated ribbon in an imprint fabricated sensor, by:
- providing a semiconductor active layer having a prescribed thickness on a substrate,
- depositing an imprintable layer on the semiconductor active layer,
- imprinting the unprintable layer in the pattern of an imprint-fabricated ribbon to create imprinted portions of the imprintable layer and non-imprinted portions of the imprintable layer,
- depositing a protective layer on both imprinted portions of the imprintable layer and non-imprinted portions of the imprintable layer,
- removing the non-imprinted portions of the imprintable layer from the substrate, wherein the non-imprinted portions include those portions of the protective layer deposited on the non-imprinted portions of the imprintable layer, and
- etching the semiconductor active layer, wherein those portions of the semiconductor active layer that are below the remaining protective layer following lift-off are substantially not etched, while those portions of the semiconductor active layer that are not below the remaining protective layer following lift-off are substantially etched.
4 more elements
A method comprising:
- fabricating an imprint-fabricated ribbon using imprint lithography, including integrating the imprint-fabricated ribbon in an imprint fabricated sensor, by:
- providing a conductor active layer having a prescribed thickness,
- depositing an imprintable layer on the conductor active layer,
- imprinting the imprintable layer,
- depositing a protective layer on both imprinted portions of the imprintable layer and non-imprinted portions of the imprintable layer,
- removing those non-imprinted portions of the imprintable layer including those portions of the protective layer deposited on the non-imprinted portions of the imprintable layer, and
- etching the conductor active layer, wherein those portions of the conductor active layer that are below the remaining protective layer following lift-off are not etched;
- and
- applying the imprint-fabricated ribbon to contact an analyte, wherein the imprint-fabricated ribbon is configured to perform sensing of target molecules contained in the analyte.
6 more elements
Dependencies are inferred from the claim text.