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US 7,410,886 B2Granted
Method for fabricating protective caps for protecting elements on a wafer surface
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWei-Chung Wang
Life of this patent
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Abstract
A method of fabricating protective caps for protecting devices on wafer surface includes: (a) providing a non-metal cap substrate and forming a metal layer on the non-metal cap substrate; (b) forming a plurality of cavities on a surface of the metal layer, wherein the location of each cavity corresponds to each of the devices on the wafer surface; and (c) forming a protective cap in each cavity and forming a plurality of bonding media around the cavities.
Claims20
A wafer level package process comprising steps:
- (a) providing a device substrate, wherein one surface of the device substrate comprises a plurality of devices and a sealed ring;
- (b) providing a non-metal cap substrate and forming a metal layer on the non-metal cap substrate;
- (c) patterning the metal layer to form a plurality of cavities on one surface of the metal layer, wherein the location of each cavity corresponds to the location of each device of the devices substrate;
- (d) forming a protective cap in each cavity by utilizing the cavity as a mold;
- (e) aligning each cavity of the non-metal cap substrate to each device of the device substrate and connecting the protective caps on the sealed ring of the device substrate, such that each of the protective caps covers each device;
- and
- (f) removing the metal layer of the non-metal cap substrate from the protective caps.
4 more elements
Dependencies are inferred from the claim text.