US 7,410,061 B2Granted

Thin plate supporting container

AssigneeMiraial Co., Ltd.

InventorsChiaki Matsutori, Tadahiro Obayashi

Life of this patent

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Abstract

A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Claims3

Dependent claims

A thin plate supporting container comprising:

a container body for housing therein a plurality of thin plates,
a lid unit for closing the container body,
slotted plates fixed on side walls facing each other in the container body for supporting the thin plates housed therein from opposing sides,
a gasket fixed between the lid unit and the container body, said gasket having a base end supporting portion for supporting the whole by being fit to a rim of the lid unit, and a flange-shaped contact portion extending from the base end supporting portion to a distal end,
wherein the contact portion is bent to form an intermediate bent portion bulging toward and contacting only the rim of the lid, and an outer periphery portion extending away from the rim to the distal end, and
wherein the intermediate portion is pressed between the lid unit and the container body and the distal end of the contact portion is in contact with only the container body, in a state where the container body is closed by the lid unit, by the elastic force of the contact portion.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/476,148Filed 28 Jun 2006 · division
Priority: JP 2002-37934027 Dec 2002
Published: US 2006/0272975 A17 Dec 2006
Granted: 12 Aug 2008
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

H10P 72/1914
Closed carriers: characterised by locking systems
H10P 72/1918
Closed carriers: characterised by coupling elements, kinematic members, handles or elements to be externally gripped
H10P 72/1921
Closed carriers: characterised by substrate supports
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered

Family

Application10/725,288Parent of this division · filed 2 Dec 2003
US 2006/0272975 A1Pre-grant publication · published 7 Dec 2006
US 2004/0124118 A1Published application
US 7,383,955 B2Related patent
US 7,410,061 B2This patent

From the US filing history. Foreign family members aren’t listed.

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