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US 7,407,359 B2Granted
Funnel plate
AssigneeDanville Automation Holdings LLC
InventorThomas P. Sisson
Life of this patent
Estimating the term…
Abstract
The invention relates to a funnel plate and method of use thereof which facilitates transfer of components from a first tray to a second tray assisting in the packaging, shipping, or assembly of electronic components. The invention provides a plate which includes at least one aperture having internal surfaces which are beveled. The sloped internal surfaces of the apertures precisely aligns electrical component transfer reducing the need for complex post-alignment testing. The funnel plates and processes of the present invention are easily integrated into modern in-line transfer machines.
Claims51
A device for a material handling system comprising:
- a first substrate for holding a material;
- a lifter with a surface that contacts the material on the first substrate and transfers the material and the surface of the lifter through a plate;
- the plate having a first end, a second end, a front side, a back side, a first surface, a second surface, and at least one aperture extending through said plate from a first hole in the first surface to a second hole in the second surface, wherein the first hole is larger than the second hole, wherein the second hole is sized to transfer the surface of the lifter and the material through the second hole, wherein the aperture is shaped to correct the alignment of the material on the surface on the lifter while maintaining the material on the surface of the lifter;
- a tray keyed to the plate;
- a catch extending from each of the first and second ends of the plate, wherein the catch attaches to a grooved portion of the tray;
- at least one clip connected to the plate, the at least one clip having a mating portion;
- and
- a plate lifting unit which attaches to the mating portion, wherein the at least one clip enables movement of the plate when the mating portion is attached to the plate lifting unit.
5 more elements
A process of manipulating semiconductor components comprising:
- contacting a component from a first substrate with a surface of a lifter,
- transferring the component and the surface of the lifter through a plate comprising a first end, a second end, a front side, a back side, a first surface, a second surface, and at least one aperture extending through the plate from a first hole in the first surface to a second hole in the second surface, wherein the first hole is larger than the second hole and wherein the plate includes a catch extending from the first and second ends of the plate, the plate correcting the alignment of the component on the surface of the lifter while maintaining the component on the surface of the lifter,
- keying a tray to the plate, wherein the catch attaches to a grooved portion of the tray;
- transferring the component from the surface of the lifter to a second substrate, wherein the plate is moved using at least one clip connected to the plate, wherein the at least one clip includes a mating portion;
- and
- attaching a plate lifting unit to the mating portion, wherein the mating portion enables movement of the plate when the mating portion is attached to the plate lifting unit.
3 more elements
A system for loading electronic packages into a tray comprising:
- a first loader station to load a substrate tray into the system;
- a second loader station to load a pallet into the system, the pallet having electronic packages disposed thereon;
- a funnel station coupled to said first loader station and said second loader station to funnel electronic packages, wherein the funnel station further comprises at least one funnel plate comprising a first end, a second end, a front side, a back side, a first surface, a second surface, and at least one aperture extending through said plate from a first hole in the first surface to a second hole in the second surface, wherein the first hole is larger than the second hole and wherein the plate includes a catch extending from each of the first and second ends of the plate;
- a tray keyed to the plate, wherein the catch attaches to a grooved portion of the tray;
- a transfer head comprising at least one lifter for transferring the electronic packages from the pallet to the substrate tray through the funnel plate;
- at least one clip connected to the funnel plate;
- and
- a plate lifting unit which attaches to a mating portion of the at least one clip, wherein mating portion enables movement of the funnel plate when the mating portion is attached to the plate lifting unit;
- and
- wherein the at least one lifter contacts an electronic package on the pallet with a surface of the lifter, transfers the electronic package and the surface of the lifter through the at least one aperture in the plate, and seats the electronic package on the substrate tray.
7 more elements
Dependencies are inferred from the claim text.