Method for production of contacts on a wafer
AssigneeInfineon Technologies AG
InventorsWerner Graf, Henning Haffner, Johannes Kowalewski, Lars Heineck
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Abstract
The invention relates to a method for production of contacts on a wafer, preferably with the aid of a lithographic process. The preferred embodiment provides a method which overcomes the disadvantages of the complex point/hole lithography process, and which avoids any increase in the process complexity. This method is achieved in that a strip structure extending over two layers is used to structure the contacts. The strip structure in the first layer is rotated at a predetermined angle with respect to the strip structure in the second layer, and the contacts are formed in the mutually overlapping areas of the strip structures in the two layers.
Claims12
A method of forming a semiconductor device, the method comprising:
- providing a surface that includes a plurality of contacts laid out in a matrix of rows and columns;
- forming a first plurality of strips over the surface, each strip in the first plurality contacting ones of the contacts disposed along a diagonal of the matrix;
- forming a second plurality of strips over the surface and over the first plurality of strips, each strip in the second plurality disposed along a row of the matrix;
- and
- removing portions of the first plurality of strips not underlying the second plurality of strips.
Dependencies are inferred from the claim text.