Baffles for high capacity air-cooling systems for electronics apparatus
AssigneeIntel Corporation
InventorsBarrett M. Faneuf, William E. Berry, Ven R. Holalkere
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AssigneeIntel Corporation
InventorsBarrett M. Faneuf, William E. Berry, Ven R. Holalkere
Estimating the term…
An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
An intake baffle comprising:
An intake baffle comprising:
A baffle for an electronic apparatus air-cooling system, comprising:
Dependencies are inferred from the claim text.