Semiconductor manufacturing system

Abstract

Provided is a semiconductor manufacturing system capable of loading a plurality of semiconductor wafers into a vertical reaction tube, and performing a thermal process. The semiconductor manufacturing system includes a first wafer loading boat, a second wafer loading boat, a plate cap, a door plate and a lifting system. The first wafer loading boat is mounted in the reaction tube and includes a plurality of holder supporters that support a wafer holder in a shape of a board, the wafer holder being loaded vertically at a predetermined interval and on which the semiconductor wafer is rested on. The second wafer loading boat is inside or outside the first wafer loading boat and has a wafer supporter that supports the semiconductor wafer. The lifting system moves either the first wafer loading boat or the second wafer loading boat vertically and separates the semiconductor wafer, which is loaded on the wafer holder, from the wafer holder at a predetermined height. The semiconductor manufacturing system makes it possible to easily load or unload the semiconductor wafer in the wafer loading boats without an additional wafer handling structure. The system also enables to control the gap between the semiconductor wafer and the wafer holder statically from the beginning of thermal processing and dynamically during the thermal processing in order to eliminate any mechanical damages to the wafer caused by stress.

Dependencies are inferred from the claim text.