IC die with directly bonded liquid cooling device

A system, comprising:

• an electronic assembly including an integrated circuit (IC) die having a die surface formed with a first semiconductor material;
• the electronic assembly further including a cooling device formed with a second semiconductor material and having a cooling plate with a first and a second cooling plate side and a plurality of interconnected channels being formed in the first cooling plate side, with the first cooling plate side being directly bonded to the die surface by a semiconductor material-to-semiconductor material bond to enclose the plurality of interconnected channels to form a plurality of liquid-conducting passages;
• an IC package having the electronic assembly mounted therein;
• a printed circuit board (PCB) having the IC package mounted thereon;
• a dynamic random access memory mounted on the PCB and electrically coupled to the electronic assembly;
• and
• an input/output interface mounted on the PCB and electrically coupled to the electronic assembly.

An apparatus, comprising:

• an integrated circuit (IC) die including a die surface formed with a first semiconductor material;
• a cooling device formed with a second semiconductor material;
• the cooling device including a cooling plate having a first and a second cooling plate side with a plurality of interconnected channels being formed in the first cooling plate side;
• a cover plate mounted to the first cooling plate side to enclose the plurality of interconnected channels to form a plurality of liquid-conducting passages;
• the second cooling plate side of the cooling plate being directly bonded to the die surface by a first semiconductor material-to-semiconductor material bond;
• and
• the cover plate and the cooling plate each including a width and a length dimension substantially equal to a width and a length dimension of the die surface.