Wiring board

A wiring board comprising:

• a wiring laminate portion including dielectric layers containing a polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers;
• and
• a plurality of metal terminal pads disposed on said first main surface, wherein:
• each of said metal terminal pads has a structure in which a layer containing Cu is disposed on a side of said first main surface and a layer containing Au is disposed in an outermost surface layer portion of said metal terminal pad, while a layer containing Ni which is an electroless Ni-plated layer having a P content not higher than 3% by weight is disposed as a barrier metal layer between said layer containing Cu and said layer containing Au layer.

A wiring board comprising:

• a wiring laminate portion including dielectric layers containing a polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers;
• and
• a plurality of metal terminal pads disposed on said first main surface;
• wherein:
• each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while a platinum-metal-based electroless plated layer is disposed as a barrier metal layer between said Cu-plated layer and said Au-plated layer.

A wiring board comprising:

• a wiring laminate portion including dielectric layers containing a polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers;
• and
• a plurality of metal terminal pads disposed on said first main surface;
• wherein:
• each of said metal terminal pads has a structure in which a layer containing Cu is disposed on a side of said first main surface and a layer containing Au is disposed in an outermost surface layer portion of said metal terminal pad, while a platinum-metal-based layer containing a metal selected from the group consisting of Ru, Rh, Pd, Os, Ir and Pt is disposed as a barrier metal layer between said layer containing Cu and said layer containing Au.

A wiring board comprising:

• a wiring laminate portion including dielectric layers containing a polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers;
• and
• a plurality of metal terminal pads disposed on said first main surface,
• wherein:
• each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an Ni—P-based electroless Ni-plated layer in contact with said Cu-plated layer and a P-barrier electroless metal plated layer for blocking or suppressing P-diffusion from said Ni—P-based electroless Ni-plated layer to said Au-plated layer are disposed as barrier metal layers between said Cu-plated layer and said Au-plated layer, said P-barrier electroless metal plated layer being disposed between said Ni—P-based electroless Ni-plated layer and said Au-plated layer.

A wiring board comprising:

• a wiring laminate portion including dielectric layers containing a polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers;
• and
• a plurality of metal terminal pads disposed on said first main surface,
• wherein:
• each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface, and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an Ni—B-based electroless Ni-plated layer in contact with said Cu-plated layer and an Ni—P-based electroless metal plated layer thinner than said Ni—B-based electroless Ni-plated layer are disposed as barrier metal layers between said Cu-plated layer and said Au-plated layer, said Ni—P-based electroless metal plated layer being disposed between said Ni—B-based electroless Ni-plated layer and said Au-plated layer.

A wiring board comprising:

• a wiring laminate portion including dielectric layers containing a polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers;
• and
• a plurality of metal terminal pads disposed on said first main surface,
• wherein:
• each of said metal terminal pads has a structure in which a layer containing Cu is disposed on a side of said first main surface, and a layer containing Au is disposed in an outermost surface layer portion of said metal terminal pad, while a layer containing Ni and B in contact with said layer containing Cu and a layer containing Ni and P thinner than said layer containing Ni and B are disposed as barrier metal layers between said layer containing Cu and said layer containing Au, said layer containing Ni and P being disposed between said layer containing Ni and B and said layer containing Au.

A wiring board comprising:

• a wiring laminate portion including dielectric layers containing a polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers;
• and
• a plurality of metal terminal pads disposed on said first main surface,
• wherein:
• each of said metal terminal pads has a structure in which a layer containing Cu is disposed on a side of said first main surface and a layer containing Au is disposed in an outermost surface layer portion of said metal terminal pad, while a layer containing Ni and P in contact with said layer containing Cu and a layer containing Ni and B are disposed as barrier metal layers between said layer containing Cu and said layer containing Au, said layer containing Ni and B being disposed between said layer containing Ni and P and said layer containing Au.