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US 7,067,332 B1Granted
Method for die removal from plastic packages
AssigneeAltera Corporation
InventorsVijay Chowdhury, John Aguada
Life of this patent
Estimating the term…
Abstract
A method for removing a die from a plastic package. The first step of the method is to remove the package's cap. Next, the package and the die within it are placed on a hot plate and heated up. When the plastic package's temperature reaches a certain limit, the plastic package cracks, resulting in at least one fracture in the package. Each side of the cracked plastic package along the fracture is then grasped by a pair of pliers and the two pairs of pliers are pulled in opposite directions. As a result, the die is detached from the plastic package.
Claims11
A method for removing a die from a plastic package, comprising:
- removing a package cap from a top surface of the plastic package;
- heating the plastic package enough such that the plastic package cracks, the cracking resulting in at least one fracture in the plastic package;
- and
- grasping the plastic package on either side of the fracture and opening the package to detach the die from the cracked plastic package.
1 more element
Dependencies are inferred from the claim text.