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US 7,030,504 B2Granted
Sectional molding system
AssigneeAsm Technology Singapore Pte Ltd
InventorsShu Chuen Ho, Jie Liu, See Yap Ong
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Abstract
The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each molding section with a molding compound and indexing means operative to position said molding sections of the substrate relative to the molding device for encapsulation.
Claims15
A molding system for encapsulating a plurality of semiconductor devices mounted on a single substrate, the system comprising:
- a molding device having a single molding cavity sized and configured to receive only a portion of the substrate therein on which less than all the semiconductor devices are mounted;
- the molding device being operative to encapsulate only the semiconductor devices enclosed by the mold cavity with a molding compound;
- and
- an indexing mechanism operative to move the substrate to bring another portion of the substrate on which others of the semiconductor devices are mounted into a position to be enclosed by the mold cavity for encapsulation.
1 more element
Dependencies are inferred from the claim text.