Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules

An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals, the electronic component system including a first electronic component with a first signal type and a second electronic component with a second signal type, wherein the first signal type interfere with the second signal type, the system comprising:

• a system framework with at least one electronic connector mounted thereto, the at least one electronic connector including system input connections and system output connections, the system framework comprising:
• a system housing;
• a first circuit card cavity configured to house a first circuit card with the first electronic component mounted thereon;
• a second circuit card cavity configured to house a second circuit card with the second electronic component mounted thereon;
• a first signal shield between the first circuit card cavity and the second circuit card cavity, the first signal shield disposed to shield the first electronic component from receiving an interfering second signal type from the second electronic component;
• and
• a thin-film evaporative spray cooling system comprising:
• a first spray module configured to provide evaporative spray cooling to the first circuit card;
• a second spray module configured to provide evaporative spray cooling to the second circuit card;
• wherein each of the first spray module and the second spray module comprise a plurality of atomizers in fluid receiving disposition to receive cooling fluid from a system cooling fluid supply, and each of the plurality of atomizers are oriented to spray cooling fluid on the circuit card corresponding to that spray module.