US 7,001,840 B1 · Interconnect with multiple layers of conductive material with grain boundary between the layers

Abstract

An interconnect structure is formed with a plurality of layers of a conductive material with a grain boundary between any two adjacent layers of the conductive material. Such grain boundaries between layers of conductive material act as shunt by-pass paths for migration of atoms of the conductive material to minimize migration of atoms of the conductive material along the interface between a dielectric passivation or capping layer and the interconnect structure. When the interconnect structure is a via structure, each of the layers of the conductive material and each of the grain boundary are formed to be perpendicular to a direction of current flow through the via structure. Such grain boundaries formed between the plurality of layers of conductive material in the via structure minimize charge carrier wind-force along the direction of current flow through the via structure to further minimize electromigration failure of the via structure.

Claims14

Dependent claims

A method for forming an interconnect structure, comprising the steps of:

forming a first layer of conductive material of the interconnect structure;
forming a second layer of the conductive material adjacent the first layer with a grain boundary between the first and second layers;
and
performing a grain boundary inducing step after formation of the first layer and before formation of the second layer;
wherein the grain boundary inducing step includes stopping deposition of the first layer within an electro-chemical deposition bath for a rest time period before deposition of the second layer within the electro-chemical deposition bath.

2 more elements

Dependencies are inferred from the claim text.

Interconnect with multiple layers of conductive material with grain boundary between the layers

Life of this patent

Interconnect with multiple layers of conductive material with grain boundary between the layers

Life of this patent

Abstract

Claims14