Electroless gold plating solution
AssigneeKanto Kagaku Kabushiki Kaisha
InventorsMasaru Kato, Ryota Iwai
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Abstract
An electroless gold plating solution is provided in which an amount of gold deposited by a displacement reaction is at least 15 μg/cm2, and the electroless gold plating solution includes a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from the above reducing agent and is oxidized by a substrate metal. The solution can form a uniform gold coating having good adhesion and low porosity in one step.
Claims11
An electroless gold plating solution in which an amount of gold deposited by a displacement reaction is at least 15 μg/cm2, said electroless gold plating solution comprising a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from said reducing agent and is oxidized by a substrate metal, and a complexing agent, wherein said electroless gold plating solution contains no cyanide, said reducing agent is one type or more than one type of compound chosen from the group consisting of sulfite, thiosulfate, hydroxylamine, a salt thereof, a derivative thereof, hydrazine, dimethylamineborane, sodium borohydride, glucose, and hypophosphite, and said complexing agent is sulfite and/or thiosulfate.
Dependencies are inferred from the claim text.