Electrical fuse element test structure and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorShien-Yang Wu
Life of this patent
Estimating the term…
Abstract
A method of monitoring heat dissipation behavior of a fuse element formed in an integrated circuit structure is provided. A fuse element is fabricated in an integrated circuit structure. A plurality of resistors are formed adjacent the fuse element, wherein a resistivity of the resistors is temperature dependent. The fuse element is triggered, whereby heat is dissipated into the integrated circuit structure. A resistance change in the resistors is monitored to determine the heat dissipation behavior of the fuse element during triggering.
Claims26
A method of monitoring heat dissipation behavior of a fuse element formed in an integrated circuit structure, comprising the steps of:
- fabricating a fuse element in an integrated circuit structure;
- forming a plurality of resistors adjacent said fuse element, wherein a resistivity of said resistors is temperature dependent;
- triggering said fuse element, whereby heat is dissipated into said integrated circuit structure;
- and
- monitoring a resistance change in said resistors to determine the heat dissipation behavior of said fuse element during triggering.
A fuse element testing system, comprising:
- an integrated circuit test structure, comprising:
- a fuse element formed over a semiconductor substrate;
- and
- a plurality of resistors formed adjacent to said fuse element, wherein a resistivity of said fuse element is temperature dependent;
- and
- means for determining a heat dissipation behavior of said fuse element during triggering by monitoring a resistance change in said resistors.
A method of monitoring heat dissipation behavior of a fuse element formed in an integrated circuit structure, comprising the steps of:
- fabricating a silicided polysilicon fuse element in an integrated circuit structure, said polysilicon fuse element including a pair of contacts and a body portion formed therebetween;
- forming a plurality of resistors adjacent said fuse element, wherein a resistivity of said resistors is temperature dependent, said plurality of resistors including a plurality of resistors formed over said fuse element, a plurality of resistors formed proximate at least one lateral edge of said body portion, or a plurality of resistors formed below said fuse element or a combination thereof;
- triggering said fuse element, whereby heat is dissipated into said integrated circuit structure;
- and
- monitoring a resistance change in said resistors to determine the heat dissipation behavior of said fuse element during triggering.
Dependencies are inferred from the claim text.