Photoresist residue remover composition
AssigneesKanto Kagaku Kabushiki Kaisha, NEC Electronics Corporation
InventorsTakuo Oowada, Norio Ishikawa, Hidemitsu Aoki, Kenichi Nakabeppu, Yoshiko Kasama
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Abstract
A photoresist residue remover composition is provided that includes one type or two or more types of fluoride compound and one type or two or more types chosen from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose (but excluding one that includes ammonium fluoride, a polar organic solvent, water, and ascorbic acid). There is also provided use of the photoresist residue remover composition for removing a photoresist residue and a sidewall polymer remaining after dry etching and after ashing.
Claims6
A photoresist residue remover composition consisting essentially of:
- a fluoride compound;
- a corrosion inhibitor for copper and aluminum selected from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose;
- and water.
A photoresist residue remover composition consisting essentially of:
- a fluoride compound;
- a corrosion inhibitor for copper and aluminum selected from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose;
- water;
- and
- a surfactant.
Dependencies are inferred from the claim text.