Film deposition to enhance sealing yield of microcap wafer-level package with vias
AssigneeAgilent Technologies, Inc.
InventorsQing Gan, Richard C. Ruby, Frank S. Geefay, Andrew T. Barfknecht
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Abstract
A method for forming a wafer package includes forming a die structure, wherein the die structure includes a first wafer, a device mounted on the first wafer, a second wafer mounted atop the first wafer with a first seal ring around the device and a second seal ring around a via contact. The method further includes forming a trench in the second wafer around the first seal ring, filling the trench and the via contact with a sealing agent, patterning a topside of the second wafer to removed the excessive sealing agent and to expose a contact pad of the via contact, and singulating a die around the first seal ring.
Claims8
A method for forming a wafer package, comprising:
- forming a die structure comprising:
- a first wafer;
- a device on the base wafer;
- a second wafer mounted atop the first wafer with a first seal ring around the device and a second seal ring around a via contact, the via contact defining a via cavity;
- forming a trench in the second wafer around the first seal ring;
- filling the trench and the via cavity with a sealing agent;
- patterning a topside of the second wafer to remove excessive sealing agent and to expose a contact pad of the via contact;
- and
- singulating a die around the first seal ring.
Dependencies are inferred from the claim text.