Laminated conductive lines and methods of forming the same

A laminated conductive line for an interconnect layer of an integrated circuit, the laminated conductive line comprising:

• a first barrier layer above a bottom of a dielectric trench;
• a first copper layer above and in contact with the first barrier layer;
• a second barrier layer above and in contact with the first copper layer;
• a second copper layer above and in contact with the second barrier layer;
• a third barrier layer above and in contact with the second copper layer;
• and
• a third copper layer above and in contact with the third barrier layer;
• whereby the conductive line includes three copper layers and three barrier layers.

An integrated circuit having a plurality of conductive lines, the integrated circuit comprising:

• a trench provided in a dielectric material;
• and
• at least a portion of a conductive line provided in the trench, the conductive line comprising:
• a first barrier metal layer;
• a first layer comprising copper provided in contact with the first barrier metal layer;
• a second barrier metal layer provided in contact with the first copper layer;
• a second layer comprising copper provided in contact with the second barrier metal layer;
• a third barrier metal layer provided in contact with the second layer comprising copper;
• and
• a third layer comprising copper provided in contact with the third barrier metal layer.