Apparatus for heating and cooling semiconductor device in handler for testing semiconductor device

A semiconductor heating and cooling apparatus for use in a device test handler, comprising:

• a thermally conductive mounting plate configured to receive and to hold at least one semiconductor device;
• a thermally conductive heating plate installed adjacent to a lower surface of the mounting plate, comprising an upper plate coupled to an upper surface of a lower plate, and a heater installed therebetween and configured to uniformly distribute a heating effect throughout the heating plate;
• a thermally conductive cooling plate installed adjacent the lower surface of the mounting plate, comprising a flow groove wherein a depth of the flow groove increases as the flow groove travels from an inlet thereof to an outlet thereof and wherein the flow groove is configured to receive cooling fluid from an external source, to uniformly distribute a cooling effect throughout the cooling plate, and to discharge the cooling fluid;
• and
• a control unit configured to control operation of the heater and a flow of cooling fluid through the cooling plate so as to control a temperature of the mounting plate.

An apparatus for heating and cooling one or more semiconductor devices in a handler for testing semiconductor devices, the apparatus comprising:

• a mounting plate comprising a plurality of recesses configured to receive the one or more semiconductor devices;
• a heating plate installed adjacent to a lower surface of the mounting plate, wherein the heating plate comprises at least one heater installed therein, and wherein the heating plate is configured to provide heat to the mounting plate;
• a cooling plate installed adjacent to a lower surface of the heating plate, comprising a flow groove wherein a depth of the flow groove increases as the flow groove travels from an inlet thereof to an outlet thereof and wherein the flow groove is configured to receive cooling fluid from an external cooling fluid supply source, and to discharge the cooling fluid to an area outside of the cooling plate;
• a heating control device configured to control a level of heat provided by the heater and to control a heating temperature of the mounting plate;
• a cooling control device configured to control an amount of cooling fluid fed to the cooling plate and to control a cooling temperature of the mounting plate;
• and
• an insulating pedestal installed at respective corners of the cooling plate such that a separation is provided between the cooling plate and a main body of the handler.

An apparatus for heating and cooling one or more semiconductor devices in a handler for testing semiconductor devices, the apparatus comprising:

• a mounting plate comprising a plurality of recesses configured to receive the one or more semiconductor devices;
• a heating plate installed adjacent to a lower surface of the mounting plate, wherein the heating plate comprises at least one heater installed therein, and wherein the heating plate is configured to provide heat to the mounting plate;
• a cooling plate installed adjacent to a lower surface of the heating plate, comprising a flow groove wherein a depth of the flow groove increases as the flow groove travels from an inlet thereof to an outlet thereof and wherein the flow groove is configured to receive cooling fluid from an external cooling fluid supply source, and to discharge the cooling fluid to an area outside of the cooling plate;
• a heating control device configured to control a level of heat provided by the heater and to control a heating temperature of the mounting plate;
• a cooling control device configured to control an amount of cooling fluid fed to the cooling plate and to control a cooling temperature of the mounting plate;
• and
• an adiabatic wall enclosing external side portions of the cooling plate and the heating plate.