Performance in flash memory devices

Abstract

In a method of fabricating a semiconductor device, a gate oxide layer is provided on a silicon substrate. A first polysilicon layer is provided on the gate oxide layer, a dielectric layer is provided on the first polysilicon layer, and a second polysilicon layer is provided on the dielectric layer. Upon appropriate masking, an etch step is undertaken, etching the second polysilicon layer, dielectric layer, first polysilicon layer, and gate oxide layer to remove portions thereof to expose the silicon substrate and to form a stacked gate structure on the silicon substrate. A rapid thermal anneal is undertaken for a short period of time, i.e., for example 10-20 seconds, to grow a thin oxide layer on the stacked gate structure. Then, another oxide layer is deposited over the oxide layer which was formed by rapid thermal anneal.

Dependencies are inferred from the claim text.