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US 6,721,196 B1Granted
Semiconductor memory chip module
AssigneeGiesecke & Devrient GmbH
InventorThomas Grassl
Life of this patent
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Abstract
In a semiconductor memory chip module (2′) for a smart card, a nonvolatile memory chip (EEPROM) (4) and a volatile memory chip (SRAM) (6) are stacked and coupled directly by vertical chip interconnections (16). The rapid-access volatile memory permits fast execution of programs. Permanent and safe storage of data is effected by reloading the data to the nonvolatile memory. A chip (8) with decoder circuits can be contained in a further level. Likewise integrated into a chip is a buffer capacitor (20) which is constantly recharged to a constant supply voltage during operation.
Claims8
A semiconductor memory chip module comprising:
- a first memory chip of a first type;
- a second memory chip a second type;
- and
- an electric connection between the first and second memory chips;
- wherein the memory chips are disposed one above the other in different levels and connected by vertical chip interconnections;
- wherein memory cells of the first memory chip are firmly allocated to certain memory cells of the second memory chip, and the mutually allocated memory cells are directly interconnected electrically.
3 more elements
Dependencies are inferred from the claim text.