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US 6,720,265 B2Granted
Composition compatible with aluminum planarization and methods therefore
AssigneeMicron Technology, Inc.
InventorDinesh Chopra
Life of this patent
Estimating the term…
Abstract
A planarization method includes providing an aluminum-containing surface and positioning it for contact with a fixed abrasive article in the presence of a composition preferably including a surfactant, a complexant, and an oxidant, wherein the solution has a pH of less than about 10.
Claims69
A planarization method comprising:
- providing a wafer comprising an aluminum-containing surface;
- positioning the aluminum-containing surface to interface with a fixed abrasive article;
- supplying a planarization composition suitable for use with the aluminum-containing surface in proximity to the interface;
- and
- planarizing the surface using the fixed abrasive article and the planarization composition, the planarization composition comprising a surfactant, a complexant, and an oxidant, wherein the planarization composition has a pH less than about 10.
2 more elements
A planarization method for use in forming an interconnect:
- providing a wafer having a patterned dielectric layer formed thereon and an aluminum-containing layer formed over the patterned dielectric layer;
- positioning a first portion of a fixed abrasive for contact with the aluminum-containing layer;
- providing a planarization composition for use with the aluminum-containing layer in proximity to the contact between the fixed abrasive and the aluminum-containing layer, wherein the planarization composition comprises a surfactant, a complexant, and about 0.5% to about 15% by volume of an oxidant, wherein the planarization composition has a pH less than about 10;
- and
- planarizing the aluminum-containing layer using the fixed abrasive and the planarization composition.
2 more elements
A planarization method comprising:
- providing a substrate assembly comprising at least one aluminum-containing surface region;
- providing a fixed abrasive;
- providing a planarization composition at an interface between the at least one surface region and the fixed abrasive suitable for use with the at least one surface region, wherein the planarization composition comprises a surfactant, a complexant, and an oxidant, wherein the planarization composition has a pH less than about 10;
- and
- planarizing the at least one surface region using the fixed abrasive and the planarization composition.
2 more elements
A planarization method comprising:
- providing a wafer comprising an aluminum-containing surface;
- locating the surface of the wafer to interface with a fixed abrasive article;
- providing a planarization composition suitable for use with the surface in proximity to the interface;
- and
- planarizing the surface using the fixed abrasive article and the planarization composition, wherein planarizing the surface comprises planarizing the surface at a temperature of about 24° C. or less, wherein the planarization composition comprises a surfactant, a complexant, and an oxidant, and further wherein the planarization composition has a pH less than about 10.
2 more elements
Dependencies are inferred from the claim text.