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AssigneeSamsung Electronics Co., Ltd.
InventorsByeung-leul Lee, Taek-ryong Chung, Joon-hyock Choi, Won-youl Choi, Kyu-dong Jung, Sang-woo Lee
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A method of reducing notching during reactive ion etching (RIE) is provided. The method is useful when RIE is performed to pass through a silicon layer on a multi-layered structure on which the silicon layer, an insulating layer and a silicon substrate are sequentially deposited. The method includes the steps of: forming an insulating layer on a silicon substrate; forming trenches on the insulating layer to expose the silicon substrate; forming a silicon layer on the insulating layer to fill the trenches; and patterning the silicon layer to form first etch regions, which pass through the silicon layer, to include the trenches. According to the method, it is possible to remarkably reduce notching without depositing a metal layer, when a multi-layered structure including a silicon layer which is etched to be passed through during RIE is fabricated.
A reactive ion etching (RIE) method performed to pass through a silicon layer on a sequentially-stacked structure of the silicon layer, an insulating layer and a silicon substrate, the method comprising the steps of:
A reactive ion etching (RIE) method performed to pass through a silicon layer on a sequentially-stacked structure of the silicon layer, an insulating layer and a silicon substrate, the method comprising the steps of:
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