Systems and methods for forming data storage devices
AssigneeHewlett-Packard Development Company, L.P.
InventorChris L. Morford
Life of this patent
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Abstract
Systems for assembling wafer stacks are provided. An embodiment of the system includes a vacuum chamber, a media deposition component and a wafer stack assembly component. The media deposition component is arranged within the vacuum chamber and is configured to deposit storage media upon a first wafer. The wafer stack assembly component also is arranged within the vacuum chamber. The wafer stack assembly component is configured to align the first wafer and a second wafer relative to each other and bond the first wafer and the second wafer together while at least a portion of the vacuum chamber is maintained under vacuum pressure. So configured, the interior chamber of the wafer stack can be formed as well as maintained under vacuum pressure. Methods also are provided.
Claims13
A method for forming a data storage device comprising:
- providing a first wafer and a second wafer, the first wafer and second wafer being configured to define therebetween an interior chamber;
- providing a vacuum chamber, the vacuum chamber defining a first zone;
- placing the first wafer within the vacuum chamber;
- maintaining the first wafer under vacuum pressure within the vacuum chamber;
- depositing storage media upon the first wafer;
- removing contaminants from a vicinity of the first wafer;
- bonding the first wafer and the second wafer together to form a wafer stack such that the interior chamber is maintained under vacuum pressure after the first wafer and second wafer are bonded together;
- and
- providing a first chamber selectively pneumatically communicating with the first zone such that, when the first chamber is not pneumatically communicating with the first zone, the first wafer can be placed in the first chamber, and when the first chamber is pneumatically communicating with the first zone, the first wafer can be transported from the first chamber and into the first zone.
A method for forming a data storage device comprising:
- providing a first wafer and a second wafer, the first wafer and second wafer being configured to define therebetween an interior chamber;
- providing a vacuum chamber, the vacuum chamber defining a first zone and a second zone, the second zone being separated from the first zone;
- placing the first wafer within the vacuum chamber;
- maintaining the first wafer under vacuum pressure;
- depositing storage media upon the first wafer within the first zone;
- removing contaminants from a vicinity of the first wafer;
- bonding the first wafer and the second wafer together to form a wafer stack such that the interior chamber is maintained under vacuum pressure after the first wafer and second wafer are bonded together;
- transporting the first wafer from the first zone to the second zone after the storage media is deposited upon the first wafer;
- and
- providing a second chamber selectively pneumatically communicating with the second zone such that, when the second chamber is pneumatically communicating with the second zone, the wafer can be transported from the second zone and into the second chamber, and when the second chamber is not pneumatically communicating with the second zone, the wafer stack can be removed from the second chamber.
Dependencies are inferred from the claim text.