Chip bonding apparatus
AssigneeToray Engineering Co., Ltd.
InventorAkira Yamauchi
Life of this patent
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Abstract
The present invention relates to a chip bonding apparatus for bonding a chip to a substrate, with a support structure for preventing a deviation or error in parallelism of a head 1 holding the chip. A first support mechanism 4 supports a pressure cylinder 3 for pressing the head 1 toward a substrate 2. A second support mechanism 5 is provided separately from and independently of the first support mechanism 4 for supporting a reactive force acting on the pressure cylinder 3 when the head 1 is pressed toward the substrate 2. The second support mechanism 5 is in contact with the pressure cylinder 3 through a spherical point of contact 12.
Claims10
A chip bonding apparatus for press-fitting a chip on a substrate, characterized by comprising a head for holding the chip, a pressure cylinder for pressing said head toward the substrate, a first support mechanism for supporting said pressure cylinder to be movable up and down, and a second support mechanism separate from and independent of said first support mechanism for supporting a reactive force acting on said pressure cylinder when said head is pressed toward the substrate.
Dependencies are inferred from the claim text.