Treating solution applying method

A treating solution applying method comprising:

• a substrate spinning step for spinning a substrate in a plane parallel to a principal plane thereof at a first spinning speed;
• a first applying step for supplying a treating solution to a surface of the substrate by moving a nozzle from a position opposed to an edge of the substrate in a spin toward a position opposed to a spin center of the substrate while delivering the treating solution from said nozzle;
• a second applying step for supplying the treating solution to the surface of the substrate by stopping said nozzle at the position opposed to the spin center of the substrate in the spin while delivering the treating solution from said nozzle;
• a third applying step for supplying the treating solution to the surface of the substrate by moving said nozzle from the position opposed to the spin center of the substrate in the spin toward a position opposed to an edge of the substrate while delivering the treating solution from said nozzle;
• and
• a film thickness adjusting step for stopping delivery of the treating solution from said nozzle, and spinning the substrate in the plane parallel to the principal plane thereof at a second spinning speed faster than said first spinning speed.