Adjustable device for heat sink retention module

An adjustable device assembly comprising:

• a circuit board on one face of which an electrical component is mounted;
• a retention module secured on said one face of the circuit board surrounding the electrical component;
• a heat sink surrounded by the retention module and attached on the electrical component;
• and
• a securing device comprising:
• a supporting plate comprising a plurality of latches;
• and
• a securing plate secured with the retention module and disposed on an opposite face of the circuit board, the securing plate comprising a plurality of fasteners corresponding to the latches,
• wherein the securing plate can be adjustably secured to the supporting plate by a selected one of the fasteners being engaged with a selected corresponding latch, thereby providing flexibility of positioning of the circuit board.

An adjustable device assembly comprising:

• a printed circuit board;
• at least one electronic component seated upon the printed circuit board;
• a supporting plate positioned under the printed circuit board, said supporting plate including three locking latches defining three sides of a rectangular configuration;
• a securing plate positioned between said supporting plate and said printed circuit board, and secured to said printed circuit board, said securing plate being moveable in a direction defining one of three different positions relative to the support plate while constantly retained by said three locking latches which abut against three sides of the securing plate;
• wherein
• at least one fastening element fastens one side of said securing plate to the supporting plate.