Metal-insulator-metal capacitor
AssigneeInternational Business Machines Corporation
InventorsNancy Anne Greco, David Louis Harame, Gary Robert Hueckel, Joseph Thomas Kocis, Dominique Nguyen Ngoc, Kenneth Jay Stein
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Abstract
An interconnection wiring system incorporating two levels of interconnection wiring separated by a first dielectric, a capacitor formed by a second dielectric, a bottom electrode of the lower interconnection wiring or a via and a top electrode of the upper interconnection wiring or a separate metal layer. The invention overcomes the problem of leakage current and of substrate stray capacitance by positioning the capacitor between two levels of interconnection wiring.
Claims15
A method for forming an interconnection wiring system containing at least one capacitor comprising the steps of:
- (a) forming a first level of interconnection wiring positioned atop a planar surface of a substrate;
- (b) forming a first dielectric layer over said first level of interconnection wiring;
- (c) forming an upper electrode layer for said at least one capacitor over said first dielectric layer;
- (d) etching a portion of said upper electrode layer selective to said first dielectric layer to form an upper electrode for said at least one capacitor;
- (e) etching said first dielectric layer selective to said first level of interconnection wiring to form a dielectric for said at least one capacitor;
- (f) etching said first level of interconnection wiring to form a base electrode for said at least one capacitor;
- and
- (g) depositing a second dielectric layer atop said upper electrode and atop said dielectric and over said upper electrode.
Dependencies are inferred from the claim text.