Method for avoiding defects produced in the CMP process
AssigneeProMOS Technologies Inc.
InventorsMing-Cheng Yang, Jiun-Fang Wang
Life of this patent
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Abstract
A method for avoiding defects produced in The CMP process has the following steps: sequentially depositing a first dielectric layer and a second dielectric layer on a semiconductor substrate, wherein the wet-etching rate of the first dielectric layer is greater than the wet-etching rate of the second dielectric layer; forming a plurality of first holes on a plurality of the predetermined contact window areas respectively; wet etching the first dielectric layer in each of the first holes to form a plurality of second holes on the plurality of the predetermined contact window areas respectively; forming a conductive layer to fill each of the second holes; and performing the CMP process to level off the conductive layer and the second dielectric layer.
Claims6
A method for avoiding defects produced in The CMP process, comprising the steps of:
- (a) providing a semiconductor substrate which has a predetermined conductive wire area;
- (b) sequentially depositing a first dielectric layer and a second dielectric layer on the semiconductor substrate, wherein the wet-etching rate of the first dielectric layer is greater than the wet-etching rate of the second dielectric layer;
- (c) performing dry etching process to form a plurality of first holes on the predetermined conductive wire area, wherein each of the first holes passes through the second dielectric layer and the first dielectric layer until a first predetermined depth;
- (d) performing wet etching process to etch the first dielectric layer in each of the first holes until a second predetermined depth, and thereby the first holes passing through each other become a second hole on the predetermined conductive wire area;
- (e) forming a conductive layer to fill the second hole;
- and
- (f) performing the CMP process to level off the conductive layer and the second dielectric layer.
Dependencies are inferred from the claim text.