Chemical mechanical polishing compositions and methods relating thereto
AssigneeRodel Holdings, Inc.
InventorsBarry Weinstein, Tirthankar Ghosh
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Abstract
A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.
Claims17
An aqueous polishing composition for selectively removing a portion of a metal layer from a semiconductor substrate during semiconductor device fabrication, comprising:
- at least one aqueous engineered copolymer, wherein said engineered copolymer comprises a first moiety and a second moiety, said first moiety comprising a hydrophilic functional group and said second moiety providing structural rigidity to said aqueous engineered copolymer and said second moiety being less hydrophilic than the first moiety.
Dependencies are inferred from the claim text.