Universal memory module/PCB storage, transport, automation handling tray

An adjustable tray for a semiconductor device comprising:

• opposing front and back frame segments;
• opposing side frame segments, each side frame segment containing a longitudinal channel therein and being secured to the front frame segment and the back frame segment to form right angles in a horizontal plane;
• a fixed locator segment secured to the tray;
• and
• an adjustable locator segment temporarily secured within the longitudinal channel of each opposing side frame segment;
• wherein both the fixed locator segment and the adjustable locator segment comprise distal ends and a plurality of slots for receiving the one or more semiconductor devices therein, the distal ends having a guide element received by the longitudinal channels of each opposing side frame segment, the guide elements of the adjustable locator segment movable within the longitudinal channels, and the one or more semiconductor devices received by the plurality of slots are removably secured by a friction fit and contact between the one or more semiconductor devices and the slots is restricted to one or more keep-out areas.

An adjustable tray for a semiconductor device comprising:

• opposing front and back frame segments;
• opposing side frame segments, each side frame segment containing a longitudinal channel therein and being secured to the front frame segment and the back frame segment to form right angles in a horizontal plane;
• and
• opposing adjustable locator segments comprising distal ends and a plurality of slots for receiving the one or more semiconductor devices, the distal ends having a guide element, the guide element being received by, and temporarily secured within, the longitudinal channel, the guide element movable within the longitudinal channel.

A method of handling a semiconductor device comprising the steps of:

• providing the semiconductor device comprising electrical components disposed thereon;
• providing a tray comprising opposing front and back frame segments, opposing side frame segments, each side frame segment containing a longitudinal channel therein and being secured to the front frame segment and the back frame segment to form right angles in a horizontal plane, the fixed locator segment secured within the tray, and the adjustable locator segment removably secured within the longitudinal channel, wherein both the fixed locator segment and the adjustable locator segment comprise distal ends and a plurality of slots for receiving the device therein, the distal ends having a guide element received by the longitudinal channels, the guide element of the adjustable locator segment movable within the longitudinal channels:
• manipulating an adjustable locator segment in the tray such that the fixed locator segment and the adjustable locator segment are spaced apart a distance commensurate with a thickness of the one or more semiconductor device;
• inserting the semiconductor device into the tray;
• and
• securing the semiconductor device within the tray with a friction fit.

A method of processing a semiconductor device using an adjustable tray, the method comprising the steps of:

• determining a thickness, an aggregate thickness, and a width of the semiconductor device;
• selecting two locator segments each having a plurality of slots therein, each slot having a slot width smaller than the thickness of the semiconductor device, and adjacent slots having a tray pitch larger than the aggregate thickness of the semiconductor device;
• inserting the two locator segments into a frame assembly by aligning guide elements on the locator segments with opposing channels in side frame segments of the frame assembly, urging the guide elements forward into the opposing channels, and securing a back frame element to the frame assembly;
• adjusting at least one of the two locator segments, by moving the guide elements of the at least one of the two locator segments within the opposing channels, such that a distance between the two locator segments corresponds with the width of the semiconductor device;
• securing the semiconductor device in the slots within the two locator segments by inserting a keep-out area of the semiconductor device into the slots to create a friction fit.