System and methods for forming data storage devices
AssigneeHewlett-Packard Development Company, L.P.
InventorChris L. Morford
Life of this patent
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Abstract
Systems for assembling wafer stacks are provided. An embodiment of the system includes a vacuum chamber, a media deposition component and a wafer stack assembly component. The media deposition component is arranged within the vacuum chamber and is configured to deposit storage media upon a first wafer. The wafer stack assembly component also is arranged within the vacuum chamber. The wafer stack assembly component is configured to align the first wafer and a second wafer relative to each other and bond the first wafer and the second wafer together while at least a portion of the vacuum chamber is maintained under vacuum pressure. So configured, the interior chamber of the wafer stack can be formed as well as maintained under vacuum pressure. Methods also are provided.
Claims13
A system for assembling a wafer stack, the wafer stack being adapted to form a data storage device, the wafer stack including a first wafer and a second wafer, the first wafer and second wafer defining therebetween an interior chamber, said system comprising:
- a vacuum chamber;
- a vacuum component pneumatically communicating with said vacuum chamber, said vacuum component being adapted to maintain at least a portion of said vacuum chamber under vacuum pressure;
- a media deposition component arranged within said vacuum chamber, said medium deposition component being configured to deposit storage media upon the first wafer;
- a control system electrically communicating with said vacuum component, said control system being adapted to provide a control signal to said vacuum component such that, in response thereto, said vacuum component maintains the pressure within a least a portion of said vacuum chamber at a selected pressure;
- and
- a wafer stack assembly component arranged within said vacuum chamber, said wafer stack assembly component being configured to align the first wafer and a second wafer relative to each other and bond the first wafer and the second wafer together while at least a portion of said vacuum chamber is maintained under vacuum pressure such that the interior chamber of the wafer stack is maintained under vacuum pressure despite removal of vacuum pressure from the vacuum chamber.
A system for assembling a wafer stack, the wafer stack being adapted to form a data storage device, the wafer stack including a first wafer and a second wafer, the first wafer and second wafer defining therebetween an interior chamber, said system comprising:
- a vacuum chamber defining a deposition zone, an intermediate zone and an assembly zone;
- a vacuum component pneumatically communicating with said vacuum chamber, said vacuum component being adapted to maintain at least a portion of said vacuum chamber under vacuum pressure;
- a medium deposition component arranged within said deposition zone, said medium deposition component being configured to deposit storage media upon the first wafer;
- a first entry lock adapted to pneumatically isolate the intermediate zone from the deposition zone;
- and
- a wafer stack assembly component arranged within said assembly zone, said wafer stack assembly component being configured to align the first wafer and a second wafer relative to each other and bond the first wafer and the second wafer together while said assembly zone is maintained under vacuum pressure such that the interior chamber of the wafer stack is maintained under vacuum pressure despite removal of vacuum pressure from the assembly zone.
Dependencies are inferred from the claim text.