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US 6,583,044 B2Granted
Buried channel in a substrate and method of making same
AssigneeAgilent Technologies, Inc.
InventorsSandeep Bahl, Karen L. Seaward
Life of this patent
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Abstract
A buried channel and a method of fabricating a buried channel in a substrate including depositing a layer of masking material onto a surface of a substrate, etching a groove in the masking layer, etching a channel into the substrate through the groove, and depositing a cover layer over the masking layer and groove such that the covering layer at least substantially closes over the groove.
Claims20
A method of fabricating a buried channel in a substrate, the method comprising:
- depositing a layer of a masking material onto a surface of the substrate;
- etching a groove through the masking layer to expose the substrate, the groove comprising sloped sidewalls that slope inward and downward;
- etching a channel into the substrate through the groove;
- and
- depositing a cover layer over the masking layer and groove such that the covering layer at least substantially covers over the groove, the sloped sidewalls operating to minimize a notch formed within the groove and proximate to the channel.
2 more elements
A buried channel, comprising:
- a substrate;
- a channel in the substrate, the channel comprising an upper portion that is open to a surface of the substrate;
- a first layer on the surface of the substrate over the channel, the first layer comprising a groove therein above at least a portion of the channel, the groove having sloped sidewalls that slope inward and downward toward the channel;
- and
- a second layer on the first layer, the second layer at least substantially covering the groove, the sloped sidewalls operating to minimize a notch formed within the groove and proximate to the channel.
2 more elements
Dependencies are inferred from the claim text.