Corrosion-resistant electrode structure for integrated circuit decoupling capacitors

A decoupling capacitor for interconnection to an integrated circuit device, comprising:

• a ceramic body;
• an electrode structure mounted to said ceramic body, said electrode structure further comprising,
• a first chromium layer formed upon said ceramic body;
• a first nickel layer formed upon said first chromium layer;
• a noble metal conductive layer formed upon said first nickel layer;
• a second nickel layer formed upon said noble metal conductive layer, said second nickel layer having a thickness which is greater than a thickness of said first nickel layer;
• and
• a second chromium layer formed upon said second nickel layer;
• a solder interconnect;
• and
• a ball limiting metallurgy (BLM), disposed between said solder interconnect and said electrode structure, said BLM preventing the spread of said solder interconnect into said noble metal conductive layer.