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US 6,554,598 B1Granted
Mold assembly for encapsulating semiconductor device
AssigneeNEC Electronics Corporation
InventorHisayuki Tsuruta
Life of this patent
Estimating the term…
Abstract
A mold assembly including: a first mold half; a second mold half relatively movable with respect to the first mold half; and a thin film disposes between the both mold halves and in contact with the surface of a semiconductor chip. Because of the contact between the edges of the surface of the semiconductor chip and the thin film, the portion of the semiconductor chip at which the burr is liable to be generated is protected and no burrs are generated.
Claims6
A mold assembly for molding a semiconductor chip comprising:
- first and second mold halves disposed for relative movement with respect to each other in a first direction for closing and opening said mold assembly;
- a mold releasing member disposed between the semiconductor chip and one of said first and second mold halves, said mold releasing member having a first surface in contact with said semiconductor chip during a closed state of the mold assembly,
- said one of said first and second mold halves applying a clamping force of about 200 kg/cm2 on the semiconductor chip during said closed state of the mold assembly to prevent burrs,
- said mold releasing member having a property of being released from said one of said first and second mold halves after molding by a resin, said first surface being larger than a surface of the semiconductor chip in contact with the first surface,
- wherein the mold releasing member is disposed between a plurality of semiconductor chips and one of said first and second mold halves, said plural semiconductor chips being in a single cavity of the mold assembly.
2 more elements
A mold assembly for molding a semiconductor chip comprising:
- first and second mold halves disposed for relative movement with respect to each other in a first direction for closing and opening said mold assembly;
- a mold releasing member disposed between the semiconductor chip and one of said first and second mold halves, said mold releasing member having a first surface in contact with said semiconductor chip during a closed state of the mold assembly,
- said one of said first and second mold halves applying a clamping force on the semiconductor chip during said closed state of the mold assembly to prevent burrs,
- said mold releasing member having a property of being released from said one of said first and second mold halves after molding by a resin, said first surface being larger than a surface of the semiconductor chip in contact with the first surface,
- wherein the mold releasing member is disposed between a plurality of semiconductor chips and one of said first and second mold halves, said one of said first and second mold halves comprising a holder element, a thrust element, and an elastic member between said holder element and said thrust element for absorbing variations in thickness of said plural semiconductor chips.
2 more elements
Dependencies are inferred from the claim text.