Device and method for protecting electronic component

Abstract

A ring-shaped device is provided for protecting an electrostatic discharge sensitive electronic component. The protective device has a thin film support structure, adhesive material for securing the support structure to the leads of the electronic component, and conductive material for electrically connecting the leads together. The adhesive material may be a pressure sensitive adhesive. The conductive material may be an annular layer of metal deposited on the support structure. In addition, a central opening is provided in the support structure to accommodate a top portion of the electronic component. The electronic component may be protected while it is stored, handled and assembled into a larger system or device, such as a circuit board. The protective device may be used with a variety of electronic components, including components with different leads configurations and also taped components. The present invention is also applicable to a taped electronic components assembly that provides electrostatic discharge protection.

Dependencies are inferred from the claim text.