Method of forming a conductive coating on a semiconductor device
AssigneeTelefonaktiebolaget LM Ericsson (publ)
InventorsTorkel Amborg, Ulf Smith
Life of this patent
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Abstract
On a semiconductor die, a conductive layer is formed by first attaching a semiconductor wafer to a support wafer, then cutting the semiconductor wafer into dies, and finally depositing a conductive layer on the sides of the dies. The conductive layer is preferably a metal layer, which extends into the support wafer, which ensures that, when the support wafer is removed, the conductive layer extends all the way over the sidewall of the semiconductor die. The method allows the simultaneous application of the conductive layer to many dies. The conductive layer reduces the resistance for currents in the radio frequency range flowing close to the edges of the die due to the skin effect.
Claims12
A method of forming a conductive layer on semiconductor dies, the method comprising the sequential steps of:
- providing a semiconductor wafer having first and second surfaces, the second surface being opposite the first surface,
- attaching the semiconductor wafer at the first surface thereof to a support wafer,
- cutting the semiconductor wafer into dies forming lateral surfaces on the dies and first and second surfaces of the dies, the first surfaces of the dies being portions of the first surface of the semiconductor wafer and the second surfaces of the dies being portions of the second surface of the semiconductor wafer, and
- depositing, when the dies are still attached to the support wafer, an electrically conductive layer over the second surface of the semiconductor wafer and thereby over the second surfaces of the dies to cover at least the lateral surfaces of the dies.
A method of forming a conductive layer on semiconductor dies, the method comprising:
- providing a semiconductor wafer,
- attaching the semiconductor wafer to a support wafer,
- cutting the semiconductor wafer into a plurality of dies, each of the dies including at least one lateral surface which extends substantially vertically relative to the support wafer, and
- depositing, when the dies are still attached to the support wafer, an electrically conductive layer over at least part of the semiconductor wafer and thus the dies so as to cover at least the lateral surfaces of the dies.
Dependencies are inferred from the claim text.