Sensor having membrane structure and method for manufacturing the same
AssigneeDenso Corporation
InventorInao Toyoda
Life of this patent
Estimating the term…
Abstract
In a sensor having a membrane structure, a sensor chip (silicon substrate) is provided with a through hole that is open on both upper and lower surfaces of the silicon substrate. A sensor element having a membrane structure is formed on the upper surface of the silicon substrate to close the through hole on the upper surface. The lower surface of the silicon substrate is bonded to a stem through adhesive to define a communication passage through which an inside and an outside of the through hole communicate with each other. Accordingly, the sensor can exhibit high reliability.
Claims20
A method for manufacturing a sensor comprising:
- providing a semiconductor substrate, wherein the substrate has a main surface and a back surface and a through hole;
- forming a sensor element on the main surface such that the sensor element forms a membrane structure that closes the through hole, wherein the through hole is open on the back surface of the substrate;
- providing a base, which includes a bonding area;
- bonding the back surface of the semiconductor substrate to the bonding area of the base to define an inner space, which is enclosed by the substrate and the sensor element and the base, and an outer space, which is outside of the inner space, wherein the bonding defines at least one communication passage that connects the inner space with an outer space, such that the inner space and the outer space communicate only through the at least one communication passage.
A method for manufacturing a sensor comprising:
- providing a semiconductor substrate, wherein the substrate has a main surface and a back surface and a through hole;
- forming a sensor element on the main surface such that the sensor element forms a membrane structure that closes the through hole, wherein the through hole is open on the back surface of the substrate;
- providing a base, which includes a first surface and a second surface and a bonding area, which is located on the first surface;
- bonding the back surface of the semiconductor substrate to the bonding area of the base to define an inner space, which is enclosed by the substrate and the sensor element and the base, and an outer space, which is outside of the inner space, wherein the bonding defines a communication passage between the substrate and the base that connects the inner space with an outer space;
- and
- preventing air from flowing into or out of the inner space through the base.
A method for manufacturing a sensor comprising:
- providing a semiconductor substrate, wherein the substrate has a main surface and a back surface and a through hole;
- forming a sensor element on the main surface such that the sensor element forms a membrane structure that closes the through hole, wherein the through hole is open on the back surface of the substrate;
- providing a base, which includes a first surface and a second surface and a bonding area, which is located on the first surface;
- bonding the back surface of the semiconductor substrate to the bonding area of the base to define an inner space, which is enclosed by the substrate and the sensor element and the base, and an outer space, which is outside of the inner space, wherein the bonding defines a communication passage between the substrate and the base that connects the inner space with an outer space;
- and
- preventing pressure differences between the inner space and the outer space by permitting gas to flow through the communication passage to extend the life of the sensor.
Dependencies are inferred from the claim text.