Fixing apparatus for heat sink
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorHao-Yun Ma
Life of this patent
Estimating the term…
Abstract
A fixing apparatus includes a retention module (10) and a back plate (30). The retention module is attached on a motherboard (20) which defines a plurality of through apertures (22). The retention module includes a plurality of posts (12) depending therefrom. Each post defines a through hole (14) in alignment with a corresponding through aperture. The back plate is attached on an underside of the motherboard, for reinforcing the motherboard. The back plate includes a plurality of upwardly extending poles (32). The poles extend through the through apertures and the through holes to protrude from the retention module. The poles are downwardly stamped forming rivet joints between the retention module and the back plate.
Claims14
A fixing apparatus assembly comprising:
- a motherboard defining a plurality of through apertures;
- a back plate attached on an underside of the motherboard to reinforce the motherboard, the back plate comprising a plurality of poles;
- and
- a retention module attached on top of the motherboard, the retention module defining a plurality of through holes in alignment with the through apertures respectively, wherein
- the poles extend through the through apertures and the through holes to protrude from the retention module, and the poles are stamped thereby forming fixed rivet joints between the retention module and the back plate.
A method for securing a fixing apparatus to a motherboard which defines a plurality of through apertures, the method comprising the steps of:
- a) providing a back plate having a plurality of poles extending upwardly therefrom;
- b) providing a retention module defining a plurality of through holes therein;
- c) attaching the back plate to an underside of the motherboard, with the poles extending through the through apertures respectively;
- d) attaching the retention module to a top side of the motherboard, the poles further extending through the through holes respectively to protrude from the retention module;
- and
- e) stamping the poles to form fixed joints between the retention module and the back plate.
Dependencies are inferred from the claim text.