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US 6,445,075 B1Granted
Semiconductor module package substrate
AssigneeAmkor Technology, Inc.
InventorsChristopher Scanlan, Jon G. Aday
Life of this patent
Estimating the term…
Abstract
A substrate includes a flip chip bond pad and a first bond pad on a dielectric substrate layer. First and second organic solderability protectant (OSP) layers are on the flip chip bond and first bond pad, respectively. A solder paste is on the first OSP layer. The solder paste is reflowed in an inert atmosphere to form a solder-on-pad (SOP) directly on and in contact with the flip chip bond pad. A sufficient thickness of the second OSP layer remains after reflow to inhibit oxidation of the first bond pad.
Claims22
A substrate comprising:
- a flip chip bond pad coupled to a dielectric substrate layer;
- a first bond pad coupled to said dielectric substrate layer;
- a first organic solderability protectant layer coupled to said flip chip bond pad;
- and
- a second organic solderability protectant layer coupled to said first bond pad.
2 more elements
A substrate comprising:
- a dielectric substrate layer;
- a first flip chip bond pad coupled to said dielectric substrate layer;
- a first organic solderability protectant layer coupled to said first flip chip bond pad;
- a first solder paste coupled to said first organic solderability protectant layer;
- a first bond pad coupled to said dielectric substrate layer;
- and
- a second organic solderability protectant layer coupled to said first bond pad.
4 more elements
A substrate comprising:
- a dielectric substrate layer comprising an upper surface and a lower surface;
- a flip chip solder mask defined bond pad coupled to said upper surface;
- a first organic solderability protectant layer coupled to said flip chip solder mask defined bond pad;
- a surface mounted device solder mask defined bond pad coupled to said upper surface;
- a second organic solderability protectant layer coupled to said surface mounted device solder mask defined bond pad;
- a ball grid array solder mask defined bond pad coupled to said lower surface;
- and
- a third organic solderability protectant layer coupled to said ball grid array solder mask defined bond pad.
5 more elements
A substrate comprising:
- a dielectric substrate layer comprising an upper surface;
- a flip chip solder mask defined bond pad coupled to said upper surface;
- a solder-on-pad directly on said flip chip solder mask defined bond pad;
- a solder mask defined bond pad coupled to said upper surface;
- and
- a first organic solderability protectant layer coupled to said solder mask defined bond pad.
3 more elements
A substrate comprising:
- a dielectric substrate layer comprising an upper surface and a lower surface;
- a flip chip solder mask defined bond pad coupled to said upper surface;
- a first organic solderability protectant layer coupled to said flip chip solder mask defined bond pad;
- a first solder paste coupled to said first organic solderability protectant layer;
- a surface mounted device solder mask defined bond pad coupled to said upper surface;
- a second organic solderability protectant layer coupled to said surface mounted device solder mask defined bond pad;
- a ball grid array solder mask defined bond pad coupled to said lower surface;
- and
- a third organic solderability protectant layer coupled to said ball grid array solder mask defined bond pad.
6 more elements
A substrate comprising:
- a means for supporting a copper flip chip solder mask defined bond pad and a copper solder mask defined bond pad, said copper flip chip solder mask defined bond pad and said copper solder mask defined bond pad being coupled to a first surface of said means for supporting;
- a means for electrically coupling said copper flip chip solder mask defined bond pad to a die pad of an integrated circuit chip, said means for electrically coupling being directly on and in contact with said copper flip chip solder mask defined bond pad;
- and
- means for solder wetting said copper solder mask defined bond pad.
1 more element
A substrate comprising:
- a dielectric substrate layer comprising an upper surface;
- a copper flip chip bond pad coupled to said upper surface;
- a first solder-on-pad directly on and in contact with said copper flip chip bond pad;
- a first copper bond pad coupled to said upper surface;
- and
- a first organic solderability protectant layer directly on and in contact with said first copper bond pad.
3 more elements
A substrate comprising:
- a dielectric substrate layer;
- a first copper flip chip bond pad coupled to said dielectric substrate layer;
- a first solder-on-pad directly on and in contact with said first copper flip chip bond pad;
- a first copper bond pad coupled to said dielectric substrate layer;
- and
- a solder ball directly on and in contact with said first copper bond pad.
3 more elements
Dependencies are inferred from the claim text.