Split-mold and method for manufacturing semiconductor device by using the same
AssigneeFujitsu Limited
InventorYasuhiro Shinma
Life of this patent
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Abstract
A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.
Claims7
A method for manufacturing semiconductor devices, comprising:
- preparing a split-mold including a first mold and a second mold;
- mounting a substrate, where a plurality of semiconductor chips are formed, on said first mold;
- placing resin on said substrate and forming a resin layer for encapsulating said substrate such that a pressing surface of said first mold and a pressing surface of said second mold are brought close to each other so as to apply a molding pressure to and make said resin spread out;
- and
- dicing said substrate into separate semiconductor chips, wherein
- said second mold includes an inner portion and at least one outer movable portion which surrounds said inner portion and is able to be separately moved with respect to said inner portion, and
- said resin is pressed by said inner portion and said at least one outer movable portion, thereby spreading out.
A method for manufacturing semiconductor devices, comprising:
- preparing a split-mold including a first mold and a second mold;
- mounting a substrate, where a plurality of semiconductor chips are formed, on said first mold;
- placing resin on said substrate and forming a resin layer for encapsulating said substrate such that a pressing surface of said first mold and a pressing surface of said second mold are brought close to each other so as to apply a molding pressure to and make said resin spread out;
- and
- dicing said substrate into separate semiconductor chips, wherein said placing further comprises attaching a mold release sheet to said pressing surface of said second mold.
A method for manufacturing semiconductor devices, comprising:
- preparing a split-mold including a first mold and a second mold;
- mounting a substrate, where a plurality of semiconductor chips are formed, on said first mold;
- placing resin on said substrate and forming a resin layer encapsulating said substrate such that a part of a pressing surface of said first mold is brought close to a pressing surface of said second mold so as to apply a molding pressure to said resin, and then a remaining part of the surface of said first mold is brought close to the pressing surface of said second mold so as to make said resin spread out on an entire surface of said substrate;
- and
- dicing said substrate into separate semiconductor chips.
Dependencies are inferred from the claim text.