Metal interconnection structure for evaluation on electromigration
AssigneeNEC Corporation
InventorYumi Saito
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Abstract
The present invention provides a novel metal interconnection structure for evaluation on electromigration thereof, wherein a test metal interconnection to be evaluated on electromigration is connected through a plurality of bamboo-structured metal interconnections to a plug metal interconnection, and the bamboo-structured metal interconnection has a smaller sectioned area than the test metal interconnection while the plug metal interconnection has a larger sectioned area than the test metal interconnection.
Claims8
A metal interconnection structure for evaluation on electromigration thereof, wherein a test metal interconnection to be evaluated on electromigration is connected with two or more sets of a plurality of bamboo-structured metal interconnections, each of said bamboo-structured metal interconnections having a smaller sectioned area than said test metal interconnection,
- wherein a first of the sets is connected to a first side of a terminal portion of the test metal interconnection, and a second of the sets is connected to a side of the terminal portion of the test metal interconnection opposite the first side.
A metal interconnection structure for evaluation on electromigration thereof, wherein a test metal interconnection to be evaluated on electromigration is connected with a plurality of bamboo-structured metal interconnections, and each of said bamboo-structured metal interconnections has a smaller sectioned area than said test metal interconnection,
- wherein said plurality of bamboo-structured metal interconnections is connected with a plug metal interconnection, and said plug metal interconnection has a larger sectioned area than said test metal interconnection,
- wherein plural sets of said plurality of bamboo-structured metal interconnections are connected with at least a side of said test metal interconnection,
- wherein plural sets of said plurality of bamboo-structured metal interconnections are connected with opposite sides of a terminal portion of said test metal interconnection.
Dependencies are inferred from the claim text.